Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound

摘要

A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.

主权项

1. A microwave device, comprising:
a semiconductor package comprising a microwave semiconductor chip; one or more plastic pieces connected to the semiconductor package, the one or more plastic pieces forming a waveguide part configured to transfer a microwave waveguide signal; and a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal for the waveguide part or to transform the microwave waveguide signal from the waveguide part into a microwave signal for the microwave semiconductor chip, wherein the semiconductor package is an embedded wafer level package, and wherein the microwave semiconductor chip is embedded as an insert in a mold compound or laminate forming an encapsulant of the semiconductor package.