发明名称 |
Method for forming image-sensor device |
摘要 |
A method for forming an image-sensor device is provided. The method includes providing a first semiconductor substrate having a first surface and a second surface opposite to the first surface. The method includes forming a device layer over the first surface of the first semiconductor substrate. The method includes bonding the first semiconductor substrate to a second semiconductor substrate after the formation of the device layer. The second surface faces the second semiconductor substrate. The method includes forming a diffusion layer between the first semiconductor substrate and the second semiconductor substrate. The diffusion layer has a dopant concentration gradient that increases in a direction from the first semiconductor substrate toward the second semiconductor substrate. |
申请公布号 |
US9620556(B2) |
申请公布日期 |
2017.04.11 |
申请号 |
US201514937372 |
申请日期 |
2015.11.10 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Tu Chien-Nan;Yeh Yu-Lung;Wu Ming-Hsien |
分类号 |
H01L27/14;H01L27/146 |
主分类号 |
H01L27/14 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A method for forming an image-sensor device, comprising:
providing a first semiconductor substrate having a first surface and a second surface opposite to the first surface; forming a device layer over the first surface of the first semiconductor substrate; after the formation of the device layer, bonding the first semiconductor substrate to a second semiconductor substrate, wherein the second surface faces the second semiconductor substrate; and forming a diffusion layer between the first semiconductor substrate and the second semiconductor substrate, wherein the diffusion layer has a dopant concentration gradient that increases in a direction from the first semiconductor substrate toward the second semiconductor substrate. |
地址 |
Hsinchu TW |