Electronic device and method for fabricating the same

摘要

Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

主权项

1. An electronic device comprising:
an elastic layer including a lower part and an upper part, each of the lower part and the upper part including an element region and a wiring region, such that the lower part includes an upper surface having a first corrugated portion and the upper part includes a lower surface having a second corrugated portion; an electronic element interposed between the element region of the lower part and the element region of the upper part; metal wirings interposed between the wiring region of the lower part and the wiring region of the upper part, the metal wirings being fully covered by the first corrugated portion of the lower part and the second corrugated portion of the upper part, the metal wirings electrically connecting the electronic element; a high rigidity pattern embedded within the upper part of the elastic layer above the electronic element, vertically overlapping the electronic element, wherein the high rigidity pattern includes a lower surface facing the electronic element and an upper surface opposite to the lower surface, the lower surface of the high rigidity pattern being spaced apart from the electronic element with the elastic layer being disposed between the high rigidity pattern and the electronic element, the upper surface of the high rigidity pattern being corrugated.