Integrated circuit package with active interposer

摘要

An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal.

主权项

1. An integrated circuit package comprising:
a substrate; an interposer having a plurality of embedded switching elements disposed over the substrate, wherein the plurality of embedded switching elements receives a plurality of power supply signals; and an integrated circuit having a plurality of circuit blocks disposed over the substrate, wherein the plurality of embedded switching elements provides at least one circuit block of the plurality of circuit blocks with a selected power supply signal of the plurality of power supply signals.