Solar cell and manufacturing method thereof

摘要

The manufacturing method of a solar cell includes forming a photoelectric conversion unit and forming an electrode connected to the photoelectric conversion unit. The step of forming the electrode includes forming a seed formation layer connected to the photoelectric conversion unit, forming an anti-oxidation layer on the seed formation layer, performing a thermal process such that a material of the seed formation layer and a material of the photoelectric conversion unit react with each other to form a chemical bonding layer at a portion at which the seed formation layer and the photoelectric conversion unit are adjacent to each other, forming a conductive layer and a capping layer on the seed formation layer in a state in which a mask is used on the seed formation layer, and patterning the seed formation layer using either the conductive layer or the capping layer as a mask.

主权项

1. A manufacturing method of a solar cell comprising:
forming a photoelectric conversion unit; forming a passivation film on the photoelectric conversion unit; and forming an electrode connected to the photoelectric conversion unit, wherein the forming of the electrode comprises:
forming contact holes formed through the passivation film;forming a metal layer connected to the photoelectric conversion unit, wherein the metal layer is formed on the passivation film to cover an exposed portion of the photoelectric conversion unit through the contact holes of the passivation film;forming an anti-oxidation layer on the metal layer to prevent oxidation of the metal layer;performing a thermal process such that a material of the metal layer and a material of the photoelectric conversion unit react with each other to form a chemical bonding layer at a portion at which the metal layer and the photoelectric conversion unit are adjacent to each other and a remaining portion of the metal layer cover the chemical bonding layer;forming a conductive layer and a capping layer on the metal layer in a state in which a mask is disposed on the metal layer; andpatterning the metal layer using one of the conductive layer and the capping layer as a mask, wherein the chemical bonding layer is formed in the contact holes of the passivation film.