发明名称 Single-poly nonvolatile memory cell
摘要 A single-poly nonvolatile memory (NVM) cell includes a PMOS select transistor on a semiconductor substrate and a PMOS floating gate transistor series connected to the PMOS select transistor. The PMOS floating gate transistor comprises a floating gate and a gate oxide layer between the floating gate and the semiconductor substrate. A protector oxide layer covers and is indirect contact with the floating gate. A contact etch stop layer is disposed on the protector oxide layer such that the floating gate is isolated from the contact etch stop layer by the protector oxide layer.
申请公布号 US9640259(B2) 申请公布日期 2017.05.02
申请号 US201514946796 申请日期 2015.11.20
申请人 eMemory Technology Inc. 发明人 Li Yi-Hung;Lai Yen-Hsin;Lo Ming-Shan;Huang Shih-Chan
分类号 H01L27/108;G11C16/10;H01L29/788;G11C16/14;H01L27/02;H01L27/115;G11C16/04;H01L27/11558;H01L29/51;H01L29/66;H01L29/792;H01L27/1157;H01L29/06;H01L29/423;G11C16/24;H01L27/11524;G11C16/34;G11C16/26;H01L29/45 主分类号 H01L27/108
代理机构 代理人 Hsu Winston;Margo Scott
主权项 1. A single-poly nonvolatile memory (NVM) cell, comprising: a select transistor on a first well of a semiconductor substrate, wherein the select transistor comprises a select gate, a first gate oxide layer between the select gate and the semiconductor substrate, a first source/drain doping region in the first well, and a second source/drain doping region spaced apart from the first source/drain doping region; a floating gate transistor on the first well serially connected to the select transistor, wherein the floating gate transistor comprises a floating gate, a second gate oxide layer between the floating gate and the semiconductor substrate, the second source/drain doping region commonly shared by the select transistor, and a third source/drain doping region spaced apart from the second source/drain doping region; a first salicide layer on the first source/drain doping region; a protector oxide layer covering and being in direct contact with the floating gate; a contact etch stop layer on the protector oxide layer such that the floating gate is isolated from the contact etch stop layer by the protector oxide layer; a first sidewall spacer provided on either sidewall of the select gate; and a second sidewall spacer provided on either sidewall of the floating gate, wherein the protector oxide layer covers and is in direct contact with a top surface of the floating gate, surfaces of the second sidewall spacers, entire surface of the second source/drain doping region, and only a portion of the third source/drain doping region.
地址 Hsin-Chu TW