| 摘要 |
The present invention provides an organic single crystal field effect circuit and method for preparing the same. The method comprises the steps of: preparing circuit masks; preparing a flexible planar embedded lamination electrode with the circuit patterns: 1) attaching octadecyl trichlorosilane on surface of a substrate; 2) preparing the source, drain and gate electrodes on the modified substrate, and attaching mercaptopropyl trimethoxysilane; 3) spin-coating polydimethyl siloxane on surfaces of the source, drain and gate electrodes, respectively; 4) diverting the gate electrode spin-coated with polydimethyl siloxane, performing oxygen plasma treatment to the metal electrode surface of the gate electrode and polydimethyl siloxane surfaces of the source and drain electrodes, respectively, to form hydroxyl; 5) tailoring the source and the drain electrodes, attaching the gate, source and drain electrodes into an integration, thereby obtaining the flexible planar embedded lamination electrode; preparing the organic single crystal field effect circuit. The present invention prepares electrodes using photolithography technique with high precision such that patterns with high precision and high complexity can be prepared, which is convenient and practicable. |
| 主权项 |
1. A preparation method for an organic signal crystal field effect circuit, comprising steps of:
(1) preparing circuit masks, comprising steps of:
1) designing circuit mask patterns of a source electrode, a drain electrode and a gate electrode, respectively, with L-editor software;2) etching, on quartz or glass spin-coated with polymethyl methacrylate, the circuit mask patterns obtained from the step 1) with a method of laser direct writing; then evaporating chromium, and removing the polymethyl methacrylate, to obtain the circuit masks of the source, drain electrode and gate electrodes; (2) preparing a flexible planar embedded lamination electrode with the circuit patterns, comprising steps of:
1) attaching octadecyl trichlorosilane on surface of a substrate;2) preparing the source, drain and gate electrodes, respectively, on the substrate modified by step 1), by means of photolithography and the circuit masks obtained from step (1); and attaching mercaptopropyl trimethoxysilane on metal electrode surfaces of the source, drain and gate electrodes;3) spin-coating polydimethyl siloxane on surfaces of the source, drain and gate electrodes obtained from step 2), respectively, and then curing;4) diverting the gate electrode spin-coated with polydimethyl siloxane from the substrate; performing oxygen plasma treatment on the metal electrode surface of the gate electrode and polydimethyl siloxane surfaces of the source and drain electrodes, respectively, thereby forming hydroxyl on the surfaces;5) tailoring the source and drain electrodes; aligning and heating the metal electrode surface of the gate electrode and the polydimethyl siloxane surfaces of the source and drain electrodes to attach the gate, source and drain electrodes into an integration, thereby obtaining the flexible planar embedded lamination electrode; (3) preparing the organic single crystal field effect circuit, comprising steps of:
placing the organic single crystal on the flexible planar embedded lamination electrode obtained from the step (2), thereby obtaining the organic single crystal field effect circuit. |
