Electronic component mounting system

摘要

An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.

主权项

1. An electronic component mounting system configured by joining a plurality of component mounting apparatuses that perform component mounting operations for mounting electronic components on substrates,
wherein each of the component mounting apparatuses has:
a first substrate conveyance mechanism and a second substrate conveyance mechanism that convey substrates received from an upstream apparatuses in a substrate conveyance direction and that each has a substrate holding section for positioning and holding the substrate,a first operation performance mechanism and a second operation performance mechanism that are provided in correspondence to the first substrate conveyance mechanism and the second substrate conveyance mechanism and that perform predetermined operation performance while taking the substrates held by the substrate holding sections as targets,an operation control section that selects any one of two modes of a first operation mode and a second operation mode and controls the first substrate conveyance mechanism, the second substrate conveyance mechanism, the first operation performance mechanism, and the second operation performance mechanism to perform the selected mode, the first operation mode letting one operation performance mechanism carry out operation performance while taking as a target only a substrate held by the substrate holding section of a substrate conveyance mechanism corresponding to the operation performance mechanism, the second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets two substrates held by the substrate holding section of the substrate conveyance mechanism and the substrate holding section of the other substrate conveyance mechanism; wherein the electronic component mounting system comprises a mode command section for commanding the operation mode to be selectively carried out in each of the component mounting apparatuses to the respective component mounting apparatuses; at least two of the component mounting apparatuses are electronic component mounting apparatuses that mount on the substrates electronic components picked up from a tray feeder by a mounting head of a component mounting mechanism that serves as the operation performance mechanism; and the mode command section sends the second operation mode as an operation mode to be selectively carried out to at least the two electronic component mounting apparatuses, and one of the tray feeders of at least the two electronic component mounting apparatuses is used in a component mounting operation intended for a substrate held by the substrate holding section of the first substrate conveyance mechanism, and the other tray feeder is used in a component mounting operation intended for a substrate held by the substrate holding section of the second substrate conveyance mechanism.