Angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections and method for producing the same

摘要

The invention relates to an angle-adjustable and/or printed circuit board structure having at least two printed circuit board sections arrangeable or arranged angularly with respect to one another, wherein the printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads, wherein the two contact pads are situated on different printed circuit board sections, wherein the printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. In order to improve the electrical and mechanical connection between the printed circuit board sections, the invention provides for the conduction element to have a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section. A corresponding method for producing this printed circuit board structure is like wise claimed.

主权项

1. An angle-adjustable and/or angled printed circuit board structure comprising:
at least two printed circuit board sections arrangeable or arranged angularly with respect to each other, wherein the printed circuit board structure comprises at least one conduction element extending between two contact pads and being electrically conductively connected to said contact pads, wherein the two contact pads are situated on different printed circuit board sections, wherein the printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections, wherein the conduction element has, as viewed in cross-section, a larger extent along the bending edge than perpendicularly thereto.