| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the height position of a lead terminal can be managed without providing a sleeve, and to provide a method of manufacturing a semiconductor device.SOLUTION: A semiconductor device includes a metal block 1, an IGBT 2, i.e., a semiconductor element bonded onto the upper surface of the metal block 1 by a brazing material 11, a lead terminal 5 bonded onto the upper surface of the IGBT 2 by a brazing material 12 of the same kind as the brazing material 11, an E electrode 7 bonded onto the upper surface of the lead terminal 5, a C electrode 6 bonded onto the upper surface of the metal block 1 by a brazing material 13 of the same kind as the brazing material 11, and a mold resin 10 covering the metal block 1, IGBT 2, lead terminal 5, C electrode 6 and E electrode 7, while exposing the lower surface of the metal block 1, and the upper surface of the C electrode 6 and E electrode 7. Both ends of the lead terminal 5 in the extension direction are projecting from the end of the metal block 1 in the horizontal direction. |
