METHOD FOR IMAGING WAFER WITH FOCUSED CHARGED PARTICLE BEAM IN SEMICONDUCTOR FABRICATION

摘要

A method for processing a semiconductor wafer is provided. The method includes positioning the semiconductor wafer in a scanning electron microscope (SEM). The method further includes producing images of at least a portion of a test region that is designated on a process surface of the semiconductor wafer. The method also includes adjusting the condition of a charged particle beam of the SEM at a check point selected in the test region. In addition, the method includes producing images of another portion of the test region after the condition of the charged particle beam is adjusted.

主权项

1. A method for processing a semiconductor wafer, comprising:
positioning the semiconductor wafer in a scanning electron microscope (SEM); producing images of at least a portion of a test region which is designated on a process surface of the semiconductor wafer; adjusting a condition of a charged particle beam of the SEM at a check point in the test region; and producing images of another portion of the test region after the condition of the charged particle beam is adjusted.