发明名称 COMPOSITION FOR REPLICA MOLDING, FORMING DIE OBTAINED FROM COMPOSITION, AND PRODUCTION METHOD OF REPLICA USING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition for replica molding capable of forming an uneven pattern easily without using emboss processing or a mold release support having the uneven pattern; and to provide a production method of a replica.SOLUTION: A replica having an uneven pattern can be obtained easily without using conventional emboss processing or mold release support by taking a process in which an aqueous solution having a lower limit critical solution temperature of 25-100°C and containing a heat gelling agent is used as a composition for replica molding, and the composition is brought into contact with a metal mold to form a mold having the uneven pattern formed thereon, and a hardening resin is brought into contact with the formed mold, and then the mold for replica molding is removed.SELECTED DRAWING: None
申请公布号 JP2016215460(A) 申请公布日期 2016.12.22
申请号 JP20150101668 申请日期 2015.05.19
申请人 TOSOH CORP 发明人 NISHIMURA HIROAKI
分类号 B29C33/38;B29C39/24;C08B11/02;C08B11/08 主分类号 B29C33/38
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