| 摘要 |
PROBLEM TO BE SOLVED: To remove particles attached to a substrate while suppressing pattern collapse and base film corrosion.SOLUTION: A substrate cleaning apparatus includes a first liquid supply part, and a second liquid supply part. The first liquid supply part supplies to a substrate a processing liquid containing a volatile component, for forming a film on the substrate. The second liquid supply part supplies a removal liquid for dissolving all of the processing liquid which is supplied to the substrate by the first liquid supply part and is solidified or cured on the substrate due to vaporization of the volatile component, and supplies to the substrate a rinse liquid for removing the dissolved processing liquid and the removal liquid remaining on the substrate from the substrate. |
