| 摘要 |
<p>1424269 Laminates SUMITOMO BAKELITE CO Ltd 19 Dec 1973 [20 June 1973] 58775/73 Heading B5N [Also in Division C3] Laminates of metals to plastic film, used in printed circuits use an adhesive composition which comprises a polyester resin (I), an isocyanate (II) and a B-stage epoxy resin (III) obtained by partial reaction of a polyepoxide and a compound containing at least 2 active hydrogen atoms. The composition may contain 100 parts by wt. of I, 1-20 parts by wt. of II and 2-50 parts by wt. of III. I may be prepared by reacting equivalent quantities of one or more saturated dibasic acid with one or more saturated dihydric alcohols. II may be tolylene diisocyanate or diphenylmethane diisocyanate, An example of III is obtained by reacting 1 equivalent of a diglycidyl ether of bisphenol A with 0À8 equivalents of m-phenylene diamine. The composition may additionally comprise, as antiblocking agent copolymers of aromatic vinyl compounds with maleic acid or alkyl maleates, at 0À5 to 20 parts by wt. per 100 parts of I. The composition may also contain 0À1-5 parts by wt. of a metal salt of a C 10 -C 30 mono- or di-carboxylic acid and from 0À5-15 parts by wt. of a pigment, per 100 parts by wt. of I. Examples relate to the lamination of polyester, polyamide, polyimide and polyvinyl chloride films to copper and aluminium.</p> |
