| 摘要 |
Active elements of a miniature circuit fixed to a glass, ceramic or metallic substrate, and electric leads connecting the active element with other parts of the circuit are individually protected against the environment and mechanical damages by applying thereon a droplet of molten glass-ceramic material (pref. a lead-zinc-broate frit.) This method is simpler and less expensive than encapsulation of the whole circuit, and less space is occupied (this is of great importance in the case of miniature circuits). The droplet insulation is resistant to thermal shocks. |
