Semiconductor packages and methods of fabricating the same

摘要

A semiconductor package including a lower package and an upper package provided may be provided. The lower package includes a lower package substrate, a lower semiconductor chip mounted thereon, and a lower mold layer provided on the lower package substrate. The upper package includes an upper package substrate and an upper semiconductor chip thereon. The lower mold layer includes a guide portion extending along a vertical direction from an edge of the lower package substrate toward the upper package.

主权项

1. A semiconductor package, comprising:
a lower package including a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower mold layer on the lower package substrate; and an upper package on the lower package, the upper package including an upper package substrate and an upper semiconductor chip thereon, wherein the lower mold layer comprises a guide portion extending vertically from an edge of the lower package, the guide portion defining a space in which the upper package is within the guide portion, and wherein the guide portion includes a first portion having a uniform width in the vertical direction and a second portion protruding from the first portion, the second portion having a width gradually decreasing in the vertical direction.