Package including a semiconductor die and a capacitive component

摘要

In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.

主权项

1. An apparatus, comprising:
a first molding layer; a second molding layer; a substrate disposed between the first molding layer and the second molding layer; a first capacitive plate disposed in the first molding layer on a first side of the substrate; a second capacitive plate disposed in the second molding layer on a second side of the substrate; and a semiconductor die disposed in the first molding layer and including a semiconductor device, the semiconductor device being electrically coupled to the first capacitive plate.