| 摘要 |
<p>A multilayered electronic circuit package is disclosed containing a cavity for the mounting of one or more electronic devices such as semiconductor chips. A metallized lead pattern at the interface of two adjacent layers of the body extends from the top surface portion of the underlying layer within the cavity to the overhanging underlying surface portion of the overlying layer of the body. Bonding wires from the electronic device may be attached to the inner ends of these metallized leads, and external leads may be attached to the exterior ends of these metallized leads.</p> |
