发明名称 Precision hole punching in printed circuit board - using punch and die with relative diameter being fixed percentage of board thickness
摘要 <p>The method is used for punching a precision hole in a metal-clad printed circuit board, in which the circuit board is supported between the punch and a die with a difference in diameter of the order 13 to 15% of the thickness of the board. The punch is moved towards the die so as to remove a part of the metal and the insulating board, simultaneously drawing the metal into the opening to line the hole. The method may be applied to produce a rotary printed circuit switch, in which the rotor is mounted in a lined hole punched in this fashion, and the individual contacts are separate metal areas on the base.</p>
申请公布号 NL7503274(A) 申请公布日期 1976.09.21
申请号 NL19750003274 申请日期 1975.03.19
申请人 OAK HOLLAND B.V. TE EMMEN. 发明人
分类号 H05K3/00;H05K3/40;(IPC1-7):05K3/22;01H11/00;01H19/54 主分类号 H05K3/00
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