| 摘要 |
1442881 Semiconductor devices RCA CORPORATION 20 Sept 1974 [28 Sept 1973] 41153/74 Heading H1K A plastics-packaged semiconductor device includes a Si chip 24, Fig. 1, comprising a Si body 29, Fig. 3, including semiconductor regions forming PN junctions at a surface 36 thereof, a passivating coating consisting of a SiO 2 layer 38 on the surface 36 and a Si 3 N 4 layer 40 on the oxide layer 38, openings 42 in the coating 38, 40 and adjacent the semiconductor regions, conductors on the coating 38, 40 contacting the regions and consisting of successive layers of Ti, Pt or Pd, and Au, and a protective coating 50, 52 of SiO 2 at least 10,000Š thick on the conductors, the conductors being connected with leads 28, and the Si body 29, the conductors and parts of the leads 28 being encapsulated in a body 11 of polymeric material. Preferably the protective coating 50, 52 consists of a 14,000 Š thick phosphorus-doped oxide layer 50 and a 1000 Š thick undoped oxide layer 52, and inhibits the tendency of the gold metallization to migrate and cause short circuits. The chip 24 is mounted on a pad 22 and the conductors are connected to wires which terminate in bonding pads adjacent the periphery of the chip 24. |
