发明名称 PRINTED BOARD AND ELECTRONIC SYSTEM
摘要 PROBLEM TO BE SOLVED: To prevent disconnection of a wiring pattern above a boundary part of a heat dissipation member embedded in a printed board and a base material.SOLUTION: A printed board 10 comprises: a base material 11 which is composed of a grass fiber and an epoxy, and is formed in a plate form; a concave part 11k provided in a lower surface of the base material 11; a metal core 3 inserted into the concave part 11k; and wiring patterns 5a, 5e, 5h, and 5i each of which is provided on an upper part of the base material 11 and the metal core 3 through a first insulation layer 1. A contact part 2t' where an inner peripheral surface of the concave part 11k and an outer peripheral surface of the metal core 3 are in contact with each other in a state where the metal core 3 is inserted into the concave part 11k, and a separation part 2s where they are not in contact with each other are formed. The epoxy of the base material 11 melting by heating is filled in between the concave part 11k and the metal core 3. The wiring patterns 5a, 5e, 5h, and 5i are provided so as to pass through a position vertically overlapping a whole part in the width direction of the separation part 2s without passing through the position vertically overlapping the whole part in the width direction of the contact part 2t'.SELECTED DRAWING: Figure 1
申请公布号 JP2016219562(A) 申请公布日期 2016.12.22
申请号 JP20150101548 申请日期 2015.05.19
申请人 OMRON AUTOMOTIVE ELECTRONICS CO LTD 发明人 KOBAYASHI TOMOYOSHI;KASASHIMA MASATO
分类号 H05K1/02;H01L23/12;H01L23/36 主分类号 H05K1/02
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