| 发明名称 | Packages with stress-reducing structures and methods of forming same | ||
| 摘要 | A chip includes a semiconductor substrate, an electrical connector over the semiconductor substrate, and a molding compound molding a lower part of the electrical connector therein. A top surface of the molding compound is lower than a top end of the electrical connector. A recess extends from the top surface of the molding compound into the molding compound. | ||
| 申请公布号 | US9472481(B2) | 申请公布日期 | 2016.10.18 |
| 申请号 | US201414175080 | 申请日期 | 2014.02.07 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Lin Chun-Hung |
| 分类号 | H01L23/31;H01L21/56;H01L21/78;H01L21/784;H01L23/00 | 主分类号 | H01L23/31 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. An integrated circuit structure comprising: a chip comprising: a semiconductor substrate;an electrical connector over the semiconductor substrate;a molding compound molding a lower part of the electrical connector therein, wherein a top surface of the molding compound is lower than a top end of the electrical connector, wherein edges of the molding compound are vertically aligned to corresponding edges of the semiconductor substrate; anda recess overlaps the semiconductor substrate and extends from the top surface of the molding compound into the molding compound, wherein the recess is adjacent to a corner of the chip, and in a top view of the chip, a lengthwise direction of the recess is neither parallel to nor perpendicular to edges of the chip. | ||
| 地址 | Hsin-Chu TW | ||