| 发明名称 |
FILM FOR TEMPORARY FIXING, FILM SHEET FOR TEMPORARY FIXING AND SEMICONDUCTOR DEVICE |
| 摘要 |
The film for temporary fixing of the present invention is a film for temporary fixing which is used in a processing method of a semiconductor wafer, the method including a temporary fixing step of temporarily fixing the semiconductor wafer to a support via the film for temporary fixing, a processing step of processing the semiconductor wafer that is temporarily fixed to the support, and a separation step of separating the processed semiconductor wafer from the support and the film for temporary fixing, contains (A) a high molecular weight component and (B) a silicone-modified resin, and has a modulus of elasticity of from 0.1 to 1000 MPa at 23° C. after being heated for 30 minutes at 110° C. and for 1 hour at 170° C. |
| 申请公布号 |
US2016326409(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201415107985 |
申请日期 |
2014.12.24 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TOKUYASU Takahiro;NATSUKAWA Masanori;OOYAMA Yasuyuki |
| 分类号 |
C09J133/00;H01L21/78;H01L25/065;C09J7/02;H01L21/683 |
主分类号 |
C09J133/00 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A film for temporary fixing used in a processing method of a semiconductor wafer, the method including:
a temporary fixing step of temporarily fixing the semiconductor wafer to a support via the film for temporary fixing; a processing step of processing the semiconductor wafer that is temporarily fixed to the support; and a separation step of separating the processed semiconductor wafer from the support and the film for temporary fixing; the film for temporary fixing comprising (A) a high molecular weight component and (B) a silicone-modified resin, wherein a modulus of elasticity of the film for temporary fixing after being heated for 30 minutes at 110° C. and for 1 hour at 170° C. is from 0.1 to 1000 MPa at 23° C. |
| 地址 |
Tokyo JP |
