| 摘要 |
PURPOSE:To obtain a high-density circuit package which features a high-density packaging and a high heat radiation property as well as reduced package processes. CONSTITUTION:The following component parts are provided: substrate 1 containing the through-hole; the cooling plate which contains projection part 4 to be inserted into through-hole 2; low-heat resistance material 5 which fills up the gap between substrate 1 and part 4 in the state under which the projection of the cooling plate is inserted; and chip 7 which is attached to substrate 1 with adhesion to material 5. Thus, the semiconductor IC chip is packaged directly to the print substrate, so the package density can be increased. At the same time, the operation speed is increased, and also the heat radiation efficiency is enhanced since the chip and the heat sink are jointed via the through-hole solder. In addition, the package assembling process number can be reduced owing to a simple constitution of just the chip, print substrate and heat sink. |
