Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects

摘要

A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. A second conductive bump may be formed on the bottom surface of the substrate, and a second mold material may encapsulate at least a portion of the second conductive bump and at least a portion of the bottom surface of the substrate. A third mold material may be formed between the first mold material and the extended substrate.

主权项

1. A semiconductor device comprising:
a first substrate comprising a top surface and a bottom surface; a semiconductor die bonded to the top surface of the first substrate; a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the first substrate; a first conductive bump on the top surface of the first substrate and a third conductive bump on the first conductive bump, wherein the first and third conductive bumps are at least partially encapsulated by the first mold material; a second substrate coupled to the first substrate utilizing the first and third conductive bumps; and a second conductive bump on the bottom surface of the first substrate.