| 发明名称 | Semiconductor device, semiconductor package, and method for manufacturing semiconductor device | ||
| 摘要 | Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate. | ||
| 申请公布号 | US9502381(B2) | 申请公布日期 | 2016.11.22 |
| 申请号 | US201514817502 | 申请日期 | 2015.08.04 |
| 申请人 | STMICROELECTRONICS PTE LTD | 发明人 | Luan Jing-En |
| 分类号 | H01L21/48;H01L21/56;H01L21/78;H01L23/00;H01L23/31;H01L23/498;H01L25/00;H01L25/065 | 主分类号 | H01L21/48 |
| 代理机构 | Seed IP Law Group LLP | 代理人 | Seed IP Law Group LLP |
| 主权项 | 1. A semiconductor device, comprising: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die, the electrical isolation layer abutting the semiconductor die and having a Rockwell hardness E scale value of at least 52; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate, the electrical isolation layer being harder than the adhesive layer. | ||
| 地址 | Singapore SG | ||