HEAT-ACTIVATED CONTACTS AND ASSEMBLY ON PRINTED-CIRCUIT BOARDS

摘要

It is known to solder electronic components to printed circuit boards but this makes subsequent component removal difficult. It is also known to use spring-loaded retaining sockets but these tend to form inferior electrical connections. The present invention provides a method of making connections which comprises bringing a plurality of reversibly-temperature-actuatable devices attached to a carrier into contact with the substrate, fixing the contact devices to the substrate, raising or lowering the temperature of the contact devices to cause them to release the carrier and then bringing a plurality of members into contact with the plurality of contact devices and raising or lowering the temperature of the contact devices to cause them to grip the members. The "reversibly-temperature-actuatable contact device" is one which will adopt a first configuration at a first temperature (released position) and a second configuration at a second temperature (gripping position).