Method for bonding a chip to a substrate

摘要

A method is provided for bonding a chip to a substrate, the method comprising the steps of providing a chip, providing a substrate, providing a recess in one of the chip and the substrate, arranging the chip and the substrate in contact with each other thereby forming a predetermined contact area and at least partly covering the recess by the other one of the chip and the substrate, and providing an amount of liquid adhesive in the recess for providing a bonding layer.

主权项

1. A method of bonding a chip to a substrate, the method comprising the steps of:
a) providing a chip, wherein the chip comprises a pressure chamber configured for containing a fluid, an actuator configured for providing a fluid pressure in the pressure chamber and a fluid channel for providing a fluid communication from a second fluid channel of the substrate towards the pressure chamber; b) providing a substrate, comprising the second fluid channel; c) providing a recess in one of the chip and the substrate; d) arranging the chip and the substrate in contact with each other thereby forming a predetermined contact area and at least partly covering the recess by the other one of the chip and the substrate; e) providing an amount of liquid adhesive in the recess only such that the liquid adhesive is confined inside the recess for providing a bonding layer in a bonding area arranged between the recess and said other one of the chip and the substrate; and f) curing the liquid adhesive, which is located in the recess, to bond the chip to the substrate, wherein the predetermined contact area formed during step d) provides a high friction force between the chip and the substrate such that a position of the chip is maintained stationary with respect to the substrate during the curing step f).