| 发明名称 | Stack frame for electrical connections and the method to fabricate thereof | ||
| 摘要 | A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts. | ||
| 申请公布号 | US9514964(B2) | 申请公布日期 | 2016.12.06 |
| 申请号 | US201514821812 | 申请日期 | 2015.08.10 |
| 申请人 | CYNTEC Co., Ltd. | 发明人 | Lu Bau-Ru;Chen Da-Jung;Lin Yi-Cheng |
| 分类号 | H01L21/00;H01L21/48;H01L23/495;H01L21/768;H01L25/00;H01L25/16;H01L23/00 | 主分类号 | H01L21/00 |
| 代理机构 | Litron Patent & Trademark Office | 代理人 | Teng Min-Lee;Litron Patent & Trademark Office |
| 主权项 | 1. A method for forming a conductive structure, the method comprising the steps of: forming a metallic frame having a plurality of metal parts, wherein each two adjacent metal parts are separated from each other by a gap; forming an insulating layer over the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer, wherein each of at least one of the first plurality of metal parts is used as a metal pin, wherein a top surface of each metal pin is electrically connected to the conductive pattern layer through a corresponding via disposed in the insulating layer and a bottom surface of each metal pin is used for electrically connecting with an external circuit. | ||
| 地址 | Hsinchu TW | ||