INSPECTION OF MICROELECTRONIC DEVICES USING NEAR-INFRARED LIGHT

摘要

Inspection of microelectronic devices is described using near infrared light. In one example, a dielectric material layer on a substrate is illuminated with a near infrared light beam. The substrate has at least one contact land, the dielectric material layer overlies at least a portion of the contact land, and the substrate has at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land. Reflected near infrared light is reflected from the substrate at a camera. The position of the via is determined relative to the contact land from the reflected light beam using an image processing device.

主权项

1. A method comprising:
illuminating a dielectric material layer on a substrate with a near infrared light beam, wherein the substrate has at least one contact land, the dielectric material layer overlying at least a portion of the contact land, the substrate having at least one via defined in the dielectric material layer, the via exposing at least a portion of the contact land; receiving a reflected near infrared light beam from the substrate at a camera; and determining the position of the via relative to the contact land from the reflected light beam using an image processing device.