印刷电路用基板及其制造方法,申请号TW06411661-传众专利搜索

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发明名称	印刷电路用基板及其制造方法
摘要
申请公布号	TW027821	申请公布日期	1979.12.01
申请号	TW06411661	申请日期	1975.08.12
申请人	住友贝克莱股份有限公司;野村镀金股份有限公司日本大阪巿西淀川区歌岛錂丁目錂番16号	发明人	野村广敏
分类号	H05K3/06	主分类号	H05K3/06
代理机构		代理人	陈世雄台北巿大安区一○六六一敦化南路六九五号八楼
主权项
地址	日本东京都千代田区内幸町1丁目2番2号

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