发明名称 SURFACE ACOUSTOC WAVE DEVICE
摘要 PURPOSE:To establish the sealing unit for surface acoustic wave devices, which is low in cost and excellent in sealed condition. CONSTITUTION:The crossing comb type electrode 22 of Al or the like is formed on the piezoelectric substrate 21, and after forming the insulation film 23 on it, the conductor layer 24 is formed on the film 23 (Figs. a, b). Next, the holes 25 to perform wire bonding to the input and output terminals and the ground terminal of the transducer is formed. (Fig. c) After that, wire bonding is made with Al or the like, and the entire unit is sealed with molding resin. Further, in this case, the Al film 24 is connected to ground. Thus, the insulation film layer is formed on the suface of the surface acoustic wave device providing electrodes on the piezoelectric substrate, and further, the insulation film forming the conductive layer on it is sealed with molding resin.
申请公布号 JPS54153590(A) 申请公布日期 1979.12.03
申请号 JP19780062666 申请日期 1978.05.24
申请人 NIPPON ELECTRIC CO 发明人 YANAGISAWA KATSUAKI
分类号 H03H3/08;H03H9/145;H03H9/25 主分类号 H03H3/08
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