ELECTRONIC COMPONENT MOUNTING DEVICE

摘要

The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

主权项

1. An electronic component mounting device that, after heating a board, performs insertion of an electronic component into the board and applying of viscous fluid to the board in parallel, the electronic component mounting device comprising:
a conveyor device that conveys the board provided in at least a heating region in which the board is heated; and a pair of rails that hold the board provided in at least a component mounting region in which the electronic component is mounted on the board.