发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To change the characteristic impedance of wiring, to form micro-, mill-wave band elements with a simple constitution and the provide a wide-band antenna with few losses by forming the pattern of a ground conductor layer in two areas different in opening areas per unit area and characteristic impedance. SOLUTION: Two copper first supply line patterns 3 of characteristic impedance 100Ω are branched from the copper second feed line pattern 4 of characteristic impedance 50Ω. Patch patterns 2 of a microstrip antenna are connected to the feed line patterns 3. A ground conductor layer 6 is grounded to the inner layer of the board through a dielectric layer 5, and the pattern changes the opening area per unit area in the two areas 17 and 18. Characteristic impedance forms the different areas. The ground conductor layer 11 is formed at the back plane of the board. Thus, the losses can be reduced be about 0.6dB with such a constitution, as compared to a structure where the ground conductor layer is covered by the same pattern as all the areas 17.
申请公布号 JPH10145112(A) 申请公布日期 1998.05.29
申请号 JP19960303268 申请日期 1996.11.14
申请人 TOSHIBA CORP 发明人 IZEKI YUJI;HANAWA TAKESHI;KONNO YOSHIO
分类号 H01P3/08;H01P5/02;H05K1/00;H05K1/02;H05K1/11;H05K3/34 主分类号 H01P3/08
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