发明名称 |
ELECTROLESS COPPER PLATING SOLUTIONS |
摘要 |
<p>Electroless copper plating bath containing a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formaldehyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained.</p> |
申请公布号 |
CA1083303(A) |
申请公布日期 |
1980.08.12 |
申请号 |
CA19770270026 |
申请日期 |
1977.01.19 |
申请人 |
N.V. PHILIPS'GLOEILAMPENFABRIEKEN |
发明人 |
MOLENAAR, ARIAN;VAN DEN BOGAERT, HENRICUS M.;BOVEN, JAN |
分类号 |
C23C18/40;(IPC1-7):23C3/00 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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