| 摘要 |
PURPOSE:To reduce the thickness of a semiconductor device easily mounted on a compact electronic equipment by bonding a semiconductor element to a printed board with conductive adhesive, bonding wires to be connected thereto by an ultrasonic bonding process and transfer molding it. CONSTITUTION:A copper foil 1a is laminated on a flexible printed board 1 made of polyimide film. A semiconductor element 2 is bonded thereto with conductive adhesive. Then, wires to be connected are bonded between the element 2 and the portion plated with gold on the copper foil 1a by an ultrasonic bonding process. With the copper foil portion 1a' retained as an external terminal the element 2 and the wires 3 are transfer molded with sealing resin 4. |
