发明名称 PREPARATION OF CONDUCTIVE RESIN MOLDED PRODUCT
摘要 PURPOSE:To obtain a conductive resin molded product, containing a homogeneously dispersed electrical conductive material and capable of being colored in any color, by the addition of cuprous iodide to a resin molded product, carried out by the adsorption of iodine and then treatment with an aqueous solution of a cuprous compound. CONSTITUTION:Iodine is adsorbed to a resin molded product. The iodine-adsorbed resin molded product obtained is allowed to contain cuprous iodine by treatment with an aquous solution of cuprous compound. In said treatment, it is preferable to treat the iodine-adsorbed molded product in the presence of copper metal, for the prevention of deterioration of the treating solution. Since a cupric ion is produced by the contact of the aqueous solution of a cuprous compound with air, it is preferable to conduct the treatment in a nitrogen atmosphere, for the prevention of the deterioration of the solution. In view of availability and hardability, the curpous compound is preferably cuprous chloride.
申请公布号 JPS5699235(A) 申请公布日期 1981.08.10
申请号 JP19800001375 申请日期 1980.01.11
申请人 TEIJIN LTD 发明人 TANAKA KUNIAKI;TSUNAAKI KIYOKAZU
分类号 C23C18/16;C08J7/00;C08J7/04;C23C18/20;C23C18/30;C23C18/31;D06M11/00;D06M11/13;D06M23/00;D06M101/00;H01B1/20 主分类号 C23C18/16
代理机构 代理人
主权项
地址