发明名称 FILM-FORMING STRUCTURE ON WORK AND FILM-FORMING METHOD ON WORK
摘要 A film-forming structure and a film-forming method on a work include closely depositing a thin primary film on a work, the primary film being a suboxide or an oxide including metal and is soft and has insulation properties and corrosion resistance. The primary film is porous film. The work is integrated with the primary film to prevent the primary film from peeling, and thereby improving the workability. The thin secondary film such as a coating is attached to the primary film closely, thereby reducing the amount of paint used. The primary film is integrated with the secondary film to prevent the secondary film from peeling, improving the workability after formation of the secondary film, and thereby forming the primary and secondary films rationally.
申请公布号 US2016362792(A1) 申请公布日期 2016.12.15
申请号 US201514820745 申请日期 2015.08.07
申请人 YOSHIDA Hideo 发明人 YOSHIDA Hideo;SUYAMA Yasuhiro
分类号 C23C18/16 主分类号 C23C18/16
代理机构 代理人
主权项 1. A film-forming structure on a work comprising: a work having a surface on which a film is formed; and a thin primary film formed by a suboxide or an oxide comprising metal, deposited on the surface of the work, and wherein the primary film is a porous film.
地址 Tokorozawa-shi JP