| 摘要 |
PURPOSE:To make automatic manufacturing easier, by mounting and sealing, with a spacer inbetween, packages of semiconductor chip so that the main surfaces of each package face each other. CONSTITUTION:A semiconductor chip 5 is mounted on an island region 2, and a bonding pad thereof is connected to a metal terminal 4 with a bonding wire 7. A semiconductor chip 5' mounted and bonded likewise is faced symmetrically with the said chip 5, with a spacer 8 inbetween. the spacer 8 is mounted in such a manner that the wires 7 and 7' do not contact and the portion of the spacer to which each upper and lower package contact is bonded and sealed. With such an arrangement, because each package, upper and lower, is formed independently, automation in manufacturing can easily be achieved. |
