| 摘要 |
<p>PURPOSE:To make it possible to provide a covering of good characteristics under a required temperature, by forming a covering compound by mixing a prescribed noncrystal PbO-B2O3 type low-melting-point glass powder with other powdery materials at a prescribed weight ratio. CONSTITUTION:A mixed compound, which is composed of 50-80% of noncrystal PbO-B2O3 type low-melting-point glass powder whose refracting point is below 500 deg.C, 10-40% of willemite powder, 1-3% each in weight ratio of zircon powder, quartz powder, corodierite powder and whose total weight ratio other than that of Gauss powder is to become 20-50%, is used for covering a silicon element having a roll joint and also a semiconductor device which is connected to molybdenum or tungsten through an alumnium brazed membrane. It is possible, by using this compound, to provide covering at a temperature below 577 deg.C at which aluminum disperses on a silicon element, and this covering is provided with excellent electrical characteristics and impact-resisting performance, and its thermal expansion efficient is to be below 40-50X(1/10<7>) deg.C.</p> |
