| 摘要 |
<p>PURPOSE:To turn a semiconductor wafer into a chip at a high recovery rate, by allowing a thin transparent glass plate and a transparent adhesive to exist between the wafer and a sticking tape. CONSTITUTION:A semiconductor wafer is attached onto a thin transparent glass plate 12 using a transparent adhesive 11, and this is further attached onto a sticking agent 7 of a sticking tape 8. And then, the glass plate 12 is cut to approximately half of its thickness by a diamond blade 6. At this time, it is possible to completely ignore influence of convexity of an electrode 5 of the wafer, and therefore it becomes the same condition as the flat wafer. When this is pushed with a round bar 10 from reverse surface of the tape 8, it becomes turned into a ship completely without causing any crack to the chip. And then, the tape is heated, stretched and inspected separately.</p> |
