| 摘要 |
PURPOSE:To obtain the cheaper device with high reliability by an arrangement wherein capacitors are formed between the laminated layers of a ceramic substrate in a sandwich structure where an oxide dielectric layer is interposed between metal layers. CONSTITUTION:A W metallized layer 13b is printed at the first layer of a ceramic substrate 1b, one end of which is connected with an external lead 15b and the other end of which is connected with other lead. Then, an oxcide dielectric layer 14b is printed on the W metallized layer 13b and another metallized layer 13b is printed thereon. Next, similar printing is effected at the second layer of the substrate 1b and both terminals thereof are connected in parallel with respect to the metallized layers of the first layer. After forming the similar laminated layers in the desired number and then calcinating, an IC chip 2b is mounted on a mount portion 3b of thus obtained package. In such a manner, by laminating a plurality of sandwich structures, it becomes possible to freely change the electrostatic capacity and to obtain the cheaper device with high reliability. |
