发明名称 THIN FILM TREATING DEVICE
摘要 PURPOSE:To excite uniformly reaction gas in a thin film treating device and to enable to form a thin film having favorable quality by a method wherein the circumference of a shower at the reaction gas blasting part and a susceptor to put a sample thereon in a bell jar is surrounded with a conductive shield, and the gas blasting part of a reaction gas introducing tube is made also to have shower structure. CONSTITUTION:The outer circumference of the reaction gas blasting part of the shower 2 and the susceptor 8 to put the sample thereon at the center of the bell jar 6 is surrounded with the shield 13 consisted of a conductive material of Al, etc. The upper part shower 11 is provided at the gas blasting part of the upper part reaction gas introducing tube 1 of the bell jar 6. Therefore reaction gas being poured uniformly from the upper part shower of the reaction gas introducing tube 1 is excited uniformly by application of a high-frequency voltage between the shield 13 and application of a high-frequency voltage of an induction coil 3, and is excited again by passing through shower conducting holes 5 at the lower part. Accordingly insufficient excitation of reaction gas is prevented, and the thin film having uniform thickness and uniform quality and having favorable quality can be formed.
申请公布号 JPS5727033(A) 申请公布日期 1982.02.13
申请号 JP19800101131 申请日期 1980.07.25
申请人 HITACHI LTD 发明人 TAKAMATSU AKIRA;SAKAI HIDEO;YOSHIMI TAKEO;SHIBATA MIYOKO
分类号 H01L21/31;C23C16/452;H01L21/302;H01L21/3065 主分类号 H01L21/31
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