| 摘要 |
PURPOSE:To make it possible to measure the warp of the printed wiring board accurately by the simple jig, by inserting a group of pins which are slidably supported by a measuring reference member into through holes in the printed wiring board, and soldering the pins. CONSTITUTION:Ends of the pins which are slidably supported by the measuring reference member are inserted into the through holes in the printed wiring board. The distance between said reference member and said wiring board is measured at the ends and the central part in the longitudinal direction. Then, the pins and the wiring board are soldered. The distance between the same positions is measured. After the temperature of the solder has decreased, the same distance is measured again. The accurate amount of the warp of the wiring board is obtained from the measured results. For example, the pins 11 which are slidably sttached to the measuring reference member 8 are slidably inserted into the through holes 5 in the printed wiring board, and the distance A at the end part and the distance B at the central part are measured. Then the pins and the wiring board are connected by the solder 12, and the distance C is measured. After the solder has cooled, the protruded amount D of the pins 11 is measured. The amounts of the warping imediately after the soldering and after the cooling of the solder are obtained by B-A, C-B-A, and C-D-A. |
