SEMICONDUCTOR CONTACT FORMED BY SERIGRAPHY

摘要

The invention relates to the formation of a contact on the surface of a semiconductor body by a serigraphy treatment by depositing a semiconductor paste with an addition of a doping element to increase the concentration of impurities at the surface during a vitrification of the said paste. According to the invention, the method uses a second deposit of a semiconductor paste in the place for soldering a connection which paste comprises no doping element.