发明名称 Production method for laminate film, laminate film, and production method for semiconductor device employing same
摘要 Provided is a manufacture method of a laminate film accurately precut into a desired shape. The manufactured laminate film comprises an elongated release film having thereon a plurality of insular adhesive films (A) and (B) mutually adjacent in the lengthwise direction, and the method includes: obtaining an elongated laminate having a release film and an adhesive film; precutting the adhesive film to obtain a first peeling part; and peeling off the first peeling part from the release film. The first peeling part includes peripheral parts (A1) and (B2) of insular adhesive films (A) and (B) respectively positioned at one and the other widthwise end side of the release film; and connection part (C) connecting peripheral parts (A1) and (B2), but not including peripheral parts (A2) and (B1) of insular adhesive films (A) and (B) respectively positioned at the other and the one widthwise end side of the release film.
申请公布号 US9475962(B2) 申请公布日期 2016.10.25
申请号 US201414780092 申请日期 2014.03.25
申请人 MITSUI CHEMICALS TOHCELLO, INC. 发明人 Hayashishita Eiji
分类号 H01L21/46;C09J7/02;H01L21/683;C09J123/14;C09J123/20;H01L21/78 主分类号 H01L21/46
代理机构 Buchanan, Ingersoll & Rooney PC 代理人 Buchanan, Ingersoll & Rooney PC
主权项 1. A method of manufacturing a laminate film comprising an elongated release film and a plurality of insular adhesive films, the insular adhesive film being either an insular adhesive film A or an insular adhesive film B which is adjacent to each other on the release film along a lengthwise direction thereof, the method comprising: obtaining an elongated laminate comprising the elongated release film and an elongated adhesive film, precutting the adhesive film in the laminate to thereby obtain a first peeling part surrounded by a cut line, and peeling off the first peeling part from the release film, wherein: the first peeling part includes a peripheral part A1 of the insular adhesive film A at one widthwise end side of the release film, a peripheral part B2 of the insular adhesive film B at the other widthwise end side of the release film and a connection part C connecting the peripheral part A1 and the peripheral part B2, but does not include a peripheral part A2 of the insular adhesive film A at the other widthwise end side of the release film and a peripheral part B1 of the insular adhesive film B at the one widthwise end side of the release film, or alternatively the first peeling part includes the peripheral part A1 of the insular adhesive film A at the one widthwise end side of the release film, the peripheral part B1 of the insular adhesive film B at the one widthwise end side of the release film and a connection part C connecting the peripheral part A1 and the peripheral part B1, but does not include the peripheral part A2 of the insular adhesive film A at the other widthwise end side of the release film and the peripheral part B2 of the insular adhesive film B at the other widthwise end side of the release film.
地址 Tokyo JP