| 摘要 |
<p>PURPOSE:To prevent the outermost wiring from corroding earlier than an inner wiring by a method wherein the outermost wiring is constituted of a highly corrosion resistant conductive material and is connected to the periphery of the bonding pad formed in the inner wiring. CONSTITUTION:A wiring 14 is formed in a semiconductor substrate 11 through an interlayer insulating film 12. The wiring 14 includes a bonding pad 14'. Formed over the wiring 14 across an interlayer insulating film 15 are wirings 171 and 172 made of material with higher anti-corrosion feature than the wiring 14. The wiring 172 is connected to the periphery of the pad 14' through the bonding window 16. It is usual with this setup that the wiring 14 is covered with an insulating film 15 protecting the wiring 14 enjoying adequately long service life and reliability thanks to the protection. No faulty bonding of the wiring 172 occurs because the pad 14' services as a bonding pad for the wiring 172 when the material constituting the 172 is inferior in point of bonding capability.</p> |
