| 摘要 |
Method of producing electronic components, e.g. resistors, capacitances, fuses and the like. The components consist of an insulating substrate with electrical connections, connected by layers or wires. In accordance with the invention, the components (5) and their connections are applied to a common substrate (1), which is provided with fractural impressions (6). The components lie in the areas between the impressions. The connections are produced by making holes in the substrate along certain of the fractural impressions (6), and the envelope surface of the holes being coated with conductive material (4), as well as an area about the holes on both sides of the substrate. The components (5) are connected to the connections, subsequent to which the substrate is divided into individual components along the fractural impressions. Certain components require adjustment in manufacture, e.g. by laser beam. This adjustment is carried out before the substrate is divided up. |
