| 摘要 |
PURPOSE:To reduce the size of substrates and to improve their reliability by providing notches for winding of coils to the substrate side parts and winding the coils directly therein. CONSTITUTION:Printed wires 5 from bonding pads 4 are connected to a substrate 9 up to respective external terminals 6, and driving coils 7 are wound in the notches 10 provided in the side parts. In the stage of packaging, these are connected through the terminals 6 to the lead terminals of the resin package and therefore the terminals 6 are exposed at all times even after the winding of the coils. The area of the substrate is reduced by this, whereby cracking is obviated and the automation of the packaging stage of the driving coils is facilitated. |
