Drive apparatus

摘要

A drive apparatus includes a power module, a connector and a heat sink. The connector is used for electric connection to an external side and has a flange, which is formed on its peripheral wall. The heat sink is formed to have a module holding part for holding the power module and a fitting hole for fitting with the flange and has a connector holding part for holding a connector. The flange is formed along a first surface, which faces the connector holding part of the peripheral wall, and side surfaces, which are formed on both sides of the first surface. Thus, water droplets are prevented from entering into a control unit through a clearance between the connector and the heat sink without adding other members such as a water preventing cover.

主权项

1. A drive apparatus comprising:
a semiconductor module including switching elements; a connector provided for electrical connection with an external part and including a peripheral wall and a first fitting part formed on the peripheral wall; a holding member including a module holding part and a connector holding part, the module holding part holding the semiconductor module, and the connector holding part being provided with a second fitting part for fitting with the first fitting part and holding the connector, wherein the first fitting part is formed on a first surface of the peripheral wall, which faces an accommodation bottom part of the connector holding part, and side walls, which are formed on both sides of the first surface; a buffer chamber formed at a fitting position, at which the first fitting part and the second fitting part are fitted each other; and a cover member for accommodating the semiconductor module and the holding member therein; wherein: the second fitting part is formed at a top end of the connector holding part; and the buffer chamber is defined by the connector, the connecter holding part and the cover member.